Electrostatic Suction Cup Cover Etch-Resistant Coating Processing

Coating process: Plasma spray, imported equipment, robotic arm spraying
Coating material: Yttrium oxide
Coating thickness: 50–100 μm

Using advanced plasma spray technology and ceramic powder materials, an etch-resistant coating is applied to the surface of the electrostatic suction cup cover component in semiconductor etching equipment. Aimed at improving the etch resistance, erosion resistance, and wear resistance of these components to ensure the stability of the wafer etching process and the reliability of product quality.

Product advantages: After plasma ceramic spray treatment, the etch resistance and wear resistance of the electrostatic suction cup cover surface are significantly improved. During long-duration etching processes, the components maintain good performance, reducing the risk of contaminating the etched wafer, improving etching process stability, effectively increasing product yield, and extending equipment service life.

Company advantages: Imported plasma spray equipment; 10+ years of spray coating production experience; 20,000 m² production base; professional spray coating technicians; 10+ spray coating production lines; cleanroom and quality inspection room.