Chamber Etch-Resistant Coating Processing

Coated part: Vacuum lower chamber
Coating material: Yttrium oxide
Coating thickness: 100–300 μm
Coating process: Plasma spray, imported equipment, robotic arm spraying
Surface roughness: Ra3.2

Using advanced plasma spray technology and ceramic powder materials, an etch-resistant coating is applied to the interior of the chamber in semiconductor etching equipment. Aimed at improving the etch resistance, corrosion resistance, and wear resistance of these components to ensure the stability of the wafer etching process and the reliability of product quality.

Company advantages: Imported plasma spray equipment; 10+ years of spray coating production experience; 20,000 m² production base; professional spray coating technicians; 10+ spray coating production lines; cleanroom and quality inspection room.