Vacuum Sealing Ring Ceramic Coating Processing

Coated part: Vacuum sealing ring
Coating process: Plasma spray, imported equipment, robotic arm spraying
Coating material: Ceramic material
Coating thickness: 300 μm / 20 μm
Surface roughness: Ra0.5
Porosity requirement: <3%

Using advanced plasma spray technology and ceramic powder materials, a ceramic coating is applied to the sealing surface of the vacuum sealing ring component in semiconductor etching equipment. Aimed at improving the etch resistance, corrosion resistance, and wear resistance of these components to ensure the stability of the wafer etching process and the reliability of product quality.

Product advantages: After plasma ceramic spray treatment, the etch resistance and wear resistance of the vacuum sealing ring surface are significantly improved. During long-duration etching processes, the components maintain good performance with excellent sealing properties, without affecting the vacuum seal. This reduces the risk of contaminating the etched wafer, effectively increases product yield, and extends equipment service life.

Company advantages: Imported plasma spray equipment; 10+ years of spray coating production experience; 20,000 m² production base; professional spray coating technicians; 10+ spray coating production lines; cleanroom and quality inspection room.